Flexible Electronic Packaging and Encapsulation Technology
| Verlag | Wiley-VCH |
| Auflage | 2024 |
| Seiten | 384 |
| Format | 17,5 x 2,4 x 25,2 cm |
| Gewicht | 881 g |
| Artikeltyp | Englisches Buch |
| ISBN-10 | 3527353593 |
| EAN | 9783527353590 |
| Bestell-Nr | 52735359A |
Systematically introduces and summarizes the fundamental and experimental research results of recent progress on flexible electronic packaging and encapsulation technology.
Inhaltsverzeichnis:
1 OVERVIEW OF FLEXIBLE ELECTRONIC ENCAPSULATING TECHNOLOGY
1.1 Flexible electronics overview
1.2 Development of flexible electronic encapsulating technology
1.3 Encapsulating technology of several important flexible electronic devices
1.4 Flexible electronic encapsulating materials
1.5 Overview of the development of flexible electronic packaging at home and abroad
2 BASIC CONCEPTS RELATED TO FLEXIBLE ELECTRONIC PACKAGING
2.1 Composition of Flexible Electronic Packaging
2.2 Flexible Electronic Packaging Structure
2.3 Encapsulation Principle
2.4 Packaging Technology
2.5 Packaging Stability
2.6 Encapsulated Products
2.7 Chapter Summary
3 FLEXIBLE SUBSTRATES
3.1 Concept and connotation of flexible substrates
3.2 Development history of flexible substrates
3.3 Flexible substrate materials
3.4 Molding technology of flexible substrate
3.5 Performance evaluation of flexible substrates
3.6 Application of flexible substrates
3.7 Development trend of flexible substrates
4 TEST METHODS
4.1 Sealing test
4.2 Bending test
4.3 Mechanical performance testing
4.4 Stability testing
5 FLEXIBLE ELECTRONIC ENCAPSULATION
5.1 Inorganic encapsulating material
5.2 Organic encapsulating material
5.3 Organic-inorganic hybrid encapsulating material
6 DEVELOPMENT OF FLEXIBLE ELECTRONICS PACKAGING TECHNOLOGY
6.1 Flexible Electronics Packaging
6.2 Thin Film Packaging Technology
7 APPLICATION OF FLEXIBLE ELECTRONICS PACKAGING
7.1 Industry chain analysis of flexible electronics packaging
7.2 Packaging applications of flexible OLED devices
7.3 Packaging applications for flexible solar cells
7.4 Packaging applications for flexible electronic devices
7.5 Packaging applications for flexible electronics sensors
8 TESTING STANDARDS
8.1 Terminology and alphabetic symbols
8.2 Mechanical test method (deformation test)
8.3 Environmental test methods
8.4 Mechanical test methods (impact and hardness tests)
9 ANALYSIS OF FLEXIBLE ELECTRONIC PACKAGING ENTERPRISE
9.1 Flexible Electronic Packaging Enterprise
9.2 Analysis of Flexible Electronic Packaging Enterprises
10 FLEXIBLE ELECTRONICS PACKAGING DEVELOPMENT TRENDS
10.1 Flexible electronics packaging trends overview
10.2 Introduction of three packaging technologies for flexible electronic devices
10.3 Flexible electronics packaging development trend summary
